Uv exposure machine for semiconductor wafers
Using binocular double field microscope alignment; Ball bowl leveling, SCM control, touch switch, easy to operate, strong practicability. The machine has the characteristics of reliable performance and easy operation.
The technical features
1. Adopt domestic original multi-point trapezoidal reflector to collect light and realize uniform lighting, with high energy harvesting rate and high uniform lighting;
2, imported DC high pressure mercury lamp, stable light power;
3, using I line (365nm) UV exposure light source, single wavelength, pure spectrum;
4, high magnification binocular double field CCD microscope and 22 inch widescreen liquid crystal, can observe the alignment process at the same time, suitable for large field of view high magnification alignment;
5, the use of film switch operation, digital set exposure time, countdown digital display, exposure amount can be precisely controlled;
6, the configuration of oil-free vacuum pump, no pollution, low noise;
7. The key components are imported international brand products with high reliability.
Exposure machine performance technology introduction
1. Exposure area: 110mm×110mm
2, exposure wavelength: 365nm (pure light source)
3, resolution: 1.5μm
4, alignment accuracy ± 1μm
5. Overall motion range of mask: X: 6mm; Y:6mm
6, mask size: 2.5 inches, 3 inches, 4 inches, 5 inches
7, diameter ф15mm - ф100mm, thickness 0.1mm- 6mm(can be extended to 15mm);
8, lighting uniformity: ±5%