The product features
● It can detect both front and back wafers at the same time
● A maximum of 6 hours of film expansion wafer detection (detection area up to 8 hours range)
● It can change grain or add new test items according to different industries
● Automatic wafer alignment mechanism after loading
● Automatic edge finding function can be applied to different shape wafers
● Defect Specification editor allows users to edit their own inspection specifications
● Defect detection rate is up to 98%
● The grain data of the upstream testing machine can be combined and uploaded to the next process equipment
● Provide test report editor, users can choose the appropriate data and analysis