Characteristic
 
 
-Automatic dicing machine/slicer (6-8 inches, 12 inches)
-Up to 12 inches silicon wafer
-Repeat accuracy (Y axis): 0.001
-Double-sided spindle, increased production (x 1.95)
-Options: 3-inch Blade, BBD (Blade Break Detector), NCS (Contactless Sensor)
-Vacuum chuck: 6-12 inches
 
Performance
-Multi-workpiece (cutting) function
-1.2 kw ~ 1.8 kw, 2.4 kw air spindle x 2 sets, facing double spindle
 
-Maximum spindle revolution: 60000rpm
 
-Blade size: 62 (for 2 "blades)
-Rotation angle: DD servo 380 (continuous/counterclockwise)
-Cutting speed: 0.05 ~ 650 mm/sec
 
 
Cuttable materials: silicon wafer, QFN, ceramics, printed circuit board, quartz, LED, mobile blue filter, silicon carbide, etc