Product features
 
Suitable for advanced developing, cleaning and drying processes
 
÷ Maximum round wafer: 8 inches/12 inches
 
÷ Maximum square substrate: 150*150mm/230*230mm
 
÷ Automatic lifting of splash-proof ring
 
÷ BSR back cleaning function
 
÷ equipped with low contact centrifugal force chuck
 
÷ Full automatic system can be provided
 
÷ Manual loading/unloading
 
Suitable for all semiconductor materials, such as silicon substrate, glass substrate and ceramic substrate
 
÷ 1x conveyor arm, up to 6 pipelines
 
Different types of nozzles
 
÷ Supply of chemical solution through pressure tank or pump system
 
÷ Rotating motor with swing effect
 
÷ Separation and discharge of different chemical liquids (1, 2 or 3-way separation)