Automatic biaxial wafer scribing machine is mainly used for semiconductor wafer, integrated circuit, QFN, light-emitting diode, LED chip, solar cell, electronic substrate cutting, suitable for silicon, quartz, alumina, iron oxide, gallium arsenide, lithium niobate, sapphire and glass and other materials. Its working principle is to drive the cutting tool of diamond grinding wheel to rotate at high speed through the air static spindle, and cut or groove the wafer or device along the direction of the cutting path.

Product Introduction:

● 1.8KW (2.4KW optional) High-power DC spindle

● High rigid gantry structure

● T axis rotation axis using DD motor

● Imported ultra-high precision roller guide rail

● Imported ultra-high precision ball screw

● CCD dual lens automatic image system

● Friendly human-machine interaction interface

● Switzerland imported roller guide, high precision, long durability, high stability, ultra-high straightness, measured 0.9μm

● Imported grinding grade ultra-high precision ball screw, positioning accuracy up to 2μm full stroke

● Auto focus function, with CSP cutting function, with online tool trace detection function

● NCS non-contact height measurement, BBD knife damage detection, automatic grinding flange function

● Workpiece shape recognition function, more friendly man-machine interface

● Improve the automation process

● Meet the needs of various processing technology