LCD laser cutting machine for mobile phone, computer, LCD screen and other display glass cutting processing.
Laser cutting glass substrate is a complex process of laser and material interaction. The process includes transient heat conduction of laser moving heat source to heat the material, thermal stress generated by gradient change of temperature field, and the use of thermal stress to induce crack propagation until fracture, so as to segment the glass substrate.
In the cutting process, due to the material by laser beam irradiation and rapid heating, and then in the convection and heat conduction under the action of rapid cooling, which will cause the material internal thermal stress field distribution imbalance, and then lead to the crack is not controllable, affect the quality of cutting. Numerical simulation of thermal stress field in laser cutting plays an important role in mastering the dynamic distribution of thermal stress field in cutting process and optimizing cutting technology.