Designed for high voltage and high current measurement applications:

Suitable for wafer level high power module measurement up to 10kV / 600A

The surface of the wafer carrier platform is gilded to reduce the contact resistance. Vacuum hole optimization, suitable for loading up to 50 μm thin wafer

Taiko wafer carrier is optional

Can be equipped with special high voltage and high current probe

Provide anti-arc solutions

Ergonomics and Safety design

Convenient wafer on chip, with a simple and fast wafer prealignment function to simplify the automated process

Interlocking grating built in, in line with safety specifications, to ensure the safety of users

Built-in shock-proof system

Complete hardware control integration, convenient more rapid and safe measurement operation

Optional Safety Test Management (STM™) allows easy on-off/off-loading at any temperature and automatic dew point control