Features:
 
Basic frame of extruded profiles
 
Size (B × T × H): 400 × 800 × 600mm
 
Weight: 20kg
 
Electric marking (consultation: pneumatic marking to improve marking force)
 
Control the marking diamond (descending and lifting) through the foot switch
 
Adjustable marking capacity (10 g … 120 g, others are available)
 
The width of the scribing slot is 5 μ m … 10 μ m (depending on the scribing force and material)
 
Adjustable descent speed
 
The height of crossed DIA is adjustable
 
The working angle of scribed diamond is adjustable
 
The scribed particles are extracted by vacuum
 
High-quality zoom microscope with stepless magnification, ranging from 8 × … 40 ×
 
• Cross-shaped eyepiece for precise line adjustment based on edges, structure, reference marks, etc
 
The optical resolution is 10 μ m better at 10 times magnification
 
· Teflon-coated vacuum wafer tray, mounted on x/y platform, 200 mm in diameter (ask for 100 mm)
 
Fine-tuning the angle of the wafer chuck with micrometer screws (10 μ m, resolution = 0.006)
 
• The tray rotates 90 ° precisely without closing the vacuum
 
The stopper can be adjusted to rotate the chuck by 90
 
· Manual x/y platform, stroke (200 x 200) mm, for marking movement and rough positioning
 
25 mm micrometer head screw, which can be accurately positioned transversely to the scribing direction
 
10mm micrometer screw for accurate positioning in the direction of scribing
 
LED ring lamp with brightness control and power supply
 
The minimum sample size is about (10 × 10) mm
 
Wafer thickness: All standard thicknesses of silicon wafers
 
Materials: silicon, gallium arsenide (GaAs) (other materials are inquired)
 
The video system (also with image processing software) is provided as an accessory