-Vertical feed grinding method, high-speed thinning of wafer by diamond grinding wheel
 
-Compatible with 2-, 3-, 4-, 5-, 6-, 8-inch wafer thinning and grinding
 
-One spindle can be equipped with coarse grinding wheel and fine grinding wheel
 
-Automatic conversion between coarse grinding and fine grinding
 
-Grinding wheel feed is controlled by high-precision servo motor, which has high grinding accuracy
 
-The system adopts high precision balance system, which can compensate the jitter in the thinning process, and has good machining stability and high repeated machining accuracy
 
-Totally enclosed grinding area
 
-The grinding wheel is diamond or CBN
 
-A variety of grinding wheels with different particle sizes and materials are used to grind different materials
 
-High precision PLC controller
 
-Ultra-low limit TTV
 
-Multiple recipe programs can be set to run automatically
 
-Various sizes of vacuum fixture
 
-Configurable film thickness measurement module
 
-Conversational man-machine PC interface, touch screen, easy to operate, can store multiple recipes