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Automatic chip bonder
 

 

Product advantage
 
On-line automatic operation, high production efficiency
 
Integrated high-precision mounting system, pre-fixing system and production data analysis system
 
Record the mounting data of each product and query the production status in real time
 
Man-machine friendly interface, easy operation and simple programming
 
The machine intelligently controls all process related parameters: pressure, temperature, time, power, light source and image, and process environment, etc.
 
The relevant functional modules can be matched freely according to the requirements: laser heating module, nozzle heating module, UV dispensing and curing module

 
 
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