Product features:
 
Full surface scanning and imaging of sub-nanometer film coatings, nanoparticles, scratches, pits, bumps, stress points and other defects.
 
 
Applicable to transparent, silicon, compound semiconductor and metal substrates.
 
 
Scan and display 300 mm wafer in 2 minutes.
 
 
Dynamic compensation for surface warping.
 
 
The location of defects can be marked for further analysis.
 
 
It can accommodate non-circular and fragile substrates up to 450 x 450 mm.
 
 
The top/bottom features on the transparent substrate can be separated by one scan.
 
 
 
 
 
 
Four detection channels for system advantages:
 
Polarization (stains, film inhomogeneity)
 
 
 
Slope (scratch, surface topography)
 
 
 
Reflectivity (internal stress, fringe)
 
 
 
Dark field (particles, inclusions)