Thin film stress and substrate warping measurement equipment, widely used in semiconductor industry thin film stress measurement. When a thin film is attached to a silicon wafer or other material substrate, stress will be generated due to the different physical constants between the substrate and the thin film, which will lead to the deformation of the substrate. Since the deformation caused by the uniformly attached film appears as the warping of the substrate, the stress can be calculated according to the change of warping (radius of curvature).