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UV Hot Melt Adhesive Dispensing Machine
 

 

Scope of application: underfill, sealing protection, BGA solder joint enhancement, camera module dispensing, fingerprint module dispensing, conductive adhesive, parts coating protection,
PCB spot solder paste, mobile phone frame spot hot melt adhesive.
Functional characteristics
1. Adopt local vision alignment system and high-precision vision positioning system to automatically identify;
2. Adopt non-contact high-precision spray dispensing system, which can carry out precise dispensing with small amount of glue in small gaps;
3. High-precision laser automatic height measurement system can be selected, which can accurately identify the height change of products to ensure the consistency of dispensing height;
4. It can automatically identify defective products or products that do not need dispensing, saving production costs;
5. By using CCD image to program, it is more convenient and fast to write teaching program, and the position accuracy of programming is also greatly improved;
6. Complicated detection functions can be completed only by a few simple teaching instructions;
The image detection system adopts industrial CCD camera, and the detection accuracy can reach 0.01 mm. The laser height detection system uses laser sensor to measure the height.
The accuracy of repeated detection can reach 0.005 mm.

 
 
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