The product features ● It can detect both front and back wafers at the same time ● A maximum of 6 hours of film expansion wafer detection (detection area up to 8 hours range) ● It can change grain or add new test items according to different industries ● Automatic wafer alignment mechanism after loading ● Automatic edge finding function can be applied to different shape wafers ● Defect Specification editor allows users to edit their own inspection specifications ● Defect detection rate is up to 98% ● The grain data of the upstream testing machine can be combined and uploaded to the next process equipment ● Provide test report editor, users can choose the appropriate data and analysis |